Techniques used in manufacturing integrated circuits

In a monolithic integrated circuit all components are fabricated by the diffusion process on a single chip of silicon . Interconnections between components are provided on the surface of the structure and external connecting wires are taken out to terminals. The vast majorityof integrated circuits are monolithic because the diffusion process is the most economicalfor mass production.

Thin Film :

Thin-film integrated circuits are constructed by depositing films of conducting materials on the surface of a glass or ceramic base.
By controlling the width and thickness of the films and by using different materials selected for their resistivity , resistors and conductors are fabricated . capacitors are produced by sandwiching a film of insulating oxide between two conducting films. Inductors are made by depositing metal film in a spiral formation . transistors and diodes are usually tiny discrete componenets connected into the circuit.

Thick-film :
Thick- film integrated circuits are sometimes referred to as printed thin-film    Circuits. In this process , silk -screen printing technique are employed to create the desired circuit pattern on a ceramic substrate . The inks used are pastes which have  conductive , resistive or dielectric properties. after printing, the circuits are fired at a high temperature in a furnace to fuse the films to the substrate .